Speaking of memory, the X13SAE-F uses ECC or non-ECC DDR5 RAM at speeds up to 4400 MHz. Memory support is currently limited to 4x 32GB or 128GB of total memory, though it is possible that the system might eventually support more if 64GB unbuffered DDR5 DIMMs are ever released. Both of the Supermicro X13 (W680) allow users to use Alder Lake-S processors with a base TDP of 125 W, and both are using a Realtek ALC888S HD audio codec. They share the same connectivity options, including HDMI 2.1, DisplayPort 1.4, and DVI video outputs, as well as three USB 3.2 G2 Type-A and one USB 3.2 G1 Type-A port on the rear panel. Both the IMB-X1233-WV and IMB-X1231 ITX sized offerings allow support for Alder Lake-S processors with a maximum TDP of 65 W, while the micro-ATX IMB-X1314 and ATX IMB-X1712 enable users to use processors with a base TDP of up to 125 W. Support and compatibility here are aligned and determined by the base frequency TDP rating on these models.

Yet since the pro variants based on the same silicon have it, it seems a clear case of exactly the type of fusing/segmentation AMD has been happy to criticize Intel for and a major inconsistency for me. CPU thermal trip support for processor protection, Control of power-on for recovery from AC power loss, Chassis intrusion detection, ATX Power connector, ACPI power management, 8-pin 12v DC power connector I red James C. Owen post in reddit and it seems that he is using this board at full power on a 24×7 basis, apparently without problems. He has a very convenient air flow, though. I would like to have ECC on my next build. One choice would be an Ryzen 9 7900 (non-X) with an Asus AM5 motherboard, another would be this Supermicro X13SAE with a Intel 13700. I like the very long term support that supermicro has (BIOS upgrades and so on), but i think that the 13900 or even the 13700 could be too much power hungry for this board. It is supposed to support up to 125 TDP CPU with up to 8P+8E cores. The heatsink on VRM are very small (if we compare them to other motherboards VRM’s heatsink). Intel® Standard Manageability requires activation and a system with a corporate network connection, an Intel® ME Firmware-enabled chipset, network hardware and software. For notebooks, Intel® ME Firmware may be unavailable or limited over a host OS-based VPN, when connecting wirelessly, on battery power, sleeping, hibernating or powered off. Results dependent upon hardware, setup & configuration. For more information, visit http://www.intel.com/technology/platform-technology/intel-amt

Intel® Standard Manageability

At the time of writing, Supermicro hasn't shared any information regarding the availability or pricing on its X13 (W680) motherboards. VBAT, System temperature, CPU temperature, 3.3V standby, 1.05 (PCH), +5V standby, +5V, +3.3V, +12V, CPU thermal trip support, +1.8V PCH I might actually be tempted to just go with a 58003D instead to offset the slower DRAM, even if this board is really more about juggling VMs. On one hand I want the responsiveness of high turbos, on the other hand this server of mine is designed for quiet and low power idle as it runs 24×7.

BVM Customisation Service If you cant find an off the shelf product that meets your specific requirements speak with our in house design team who can customize an existing product or design a new product from start to finish.If using PCIEx8/x16 card on PCIE2/PCIE4 slot, M.2 Key M2(M2_M2) and M.2 Key E(M2_E1) are limited to install. But while the Intel's Xeon E-3300-series processors and Intel's W680 platform are getting closer, we still have little idea about what to expect from new CPUs and chipset. Early leaks indicated that the new entry-level server/workstation platform will offer up to 16 CPU cores with TDPs of 35 W, 65 W and 125 W. Meanwhile, we have no idea whether Intel intends to enable AVX-512 support on its upcoming Xeon E-3300-series processors, or will keep it disabled, like it does with 12thGeneration Core CPUs.