Tomorrow's Kitchen 3548360Cool Plate

Product Information

Previously, hot-rolled plates cooled to room temperature before low-temperature rolling and processing—standard practice for high-strength low alloy steel grades (HSLA). Examples of processing included normalizing and annealing or quenching and temper processing. Before inline plate cooling, steel producers used these steps to tailor the air-cooled plate microstructure for final applications, for example, abrasion-resistant plates. However, with the application of inline cooling, steel producers can achieve target microstructures with temperature control for accelerated cooling and direct quenching. A schematic diagram illustrating post-rolling options with and without inline cooling technology reveals the impact of inline cooling on manufacturing time. Moreover, inline cooling offers various cooling strategies following rolling for different steel grades. Direct Impact of inline Cooling Thermoelectric cooling uses the Peltier effect to create a heat flux at the junction of two different types of materials. A Peltier cooler, heater, or thermoelectric heat pump is a solid-state active heat pump which transfers heat from one side of the device to the other, with consumption of electrical energy, depending on the direction of the current. Such an instrument is also called a Peltier device, Peltier heat pump, solid state refrigerator, or thermoelectric cooler ( TEC) and occasionally a thermoelectric battery. It can be used either for heating or for cooling, [1] although in practice the main application is cooling. It can also be used as a temperature controller that either heats or cools.

Dependent on the required thermal performance and the cooling fluid to be used the tube can be copper or stainless steel and can be a simple mechanical (dry) press fit, press fit with a thermal epoxy boundary to eliminate micro voids or soldered in place for maximum thermal performance. Gun Drilled (Liquid cold plate)

Cold Plate Features & Benefits

Key mechanical property predictions, including yield strength, ultimate tensile strength, elongation, and hardness While online operations can experience improvements, offline analysis of aspects of inline cooling improves the function of MULPIC—from heat transfer and metallurgical properties to the impact of the cooling machine. MULPIC’s Digital Twin is a model that utilizes the same models as the Level 2 control system and cooling model that adds a user interface to perform offline simulations. These simulations allow steel producers to optimize the cooling process fully. These cold plates have the advantage that there are no thermal boundaries and the aluminium plate has had no thermal stress during the manufacturing process so flatness is easier to achieve. FSW Friction stir welded (Liquid cold plate)

While the MULPIC system consists of a cooling machine featuring precision valve control and an advanced automation system, a process model, or “digital twin,” allows for the integration of historical data, real-time information, and model adaption to impact the efficiency of continuous operation. Accelerated cooling of hot-rolled sheets emerged in the 1980s. Today, “alloying with water” is standard practice in the steel industry, where micro-alloyed steel plates are cooled directly after rolling, achieving the desired strength, flatness, and toughness. However, the value of accelerated cooling extends beyond the ability to achieve the desired microstructure and product quality but also allows for the elimination of expensive reheating practices, efficient water utilization, improved yield, and an accelerated production time. Each bank includes an independently driven edge masking system on each side of the cooling machine, preventing overcooling which may lead to the poor flatness of the plate following the cooling process. Head and Tail MaskingTwo unique semiconductors, one n-type and one p-type, are used because they need to have different electron densities. The alternating p & n-type semiconductor pillars are placed thermally in parallel to each other and electrically in series and then joined with a thermally conducting plate on each side, usually ceramic, removing the need for a separate insulator. When a voltage is applied to the free ends of the two semiconductors there is a flow of DC current across the junction of the semiconductors, causing a temperature difference. The side with the cooling plate absorbs heat which is then transported by the semiconductor to the other side of the device.